Circuit board thermal relief pattern having improved electrical and EMI characteristics
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United States of America Patent
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Sep 19, 1995
Grant Date -
N/A
app pub date -
Mar 23, 1994
filing date -
Mar 23, 1994
priority date (Note) -
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status (Latency Note)
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Abstract
A circuit board having a thermal relief pattern for isolating heat generated during soldering of components thereon. The circuit board comprises (1) a substantially planar insulating substrate, the substrate having a via therethrough and (2) a substantially planar conductive layer located over the substrate, the via passing through the layer, the layer having a thermal relief pattern comprising a plurality of apertures located about the via, the plurality of apertures cooperating to restrict heat flow across the thermal relief pattern, each of the plurality of apertures having a boundary with the conductive layer free of discontinuities to inhibit edge effect electromagnetic resonance, the plurality of apertures defining a plurality of corresponding conductive bands in the conductive layer and between the plurality of apertures, the conductive bands cooperating to provide a predetermined minimum level of electrical conduction across the thermal relief pattern.
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