Improved process for effecting electromagnetic bonding of plastic parts
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United States of America Patent
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Sep 26, 1995
Issued Date -
N/A
app pub date -
Feb 7, 1991
filing date -
Feb 2, 1990
priority date (Note) -
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Abstract
An improved electromagnetic bonding process wherein the plastic parts or components to be bonded are configured to be positioned with respect to each other at the point of bonding under a frictional or interference fitting relationship embraced by the interpositioning of thermoplastic electromagnetic bonding material at the bonding point whereupon an electromagnetic field is generated to melt thermoplastic electromagnetic bonding material thereby fusing the plastic parts or components. In a particularly preferred embodiment a plastic container is formed having hemispherically-shaped top and bottom closures bonded to a cylindrically-shaped body member.
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