Method for making an interconnection structure for integrated circuits
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United States of America Patent
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Sep 26, 1995
Issued Date -
N/A
app pub date -
Mar 24, 1994
filing date -
Oct 13, 1992
priority date (Note) -
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status (Latency Note)
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Abstract
A device for making temporary or permanent electrical connections to circuit pads of an integrated circuit is made with conventional semiconductor fabrication processes. The device has a supporting substrate from which project a plurality of insertion structures that are in mating alignment with corresponding circuit pads of the integrated circuit. Each insertion structure is metallized to make electrical contact with the corresponding circuit pad. The electrical contacts may be temporary or permanent depending upon the choice of metallization and the pressure applied to the contacting surfaces. The insertion structure devices have particular application for functional testing, electrical burn-in and packaging of an integrated circuit either as a full wafer or as an individual die.
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