Bonding and encapsulated three dimensional hybrid integrated circuit modules
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United States of America Patent
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-
Sep 26, 1995
Grant Date -
N/A
app pub date -
Aug 4, 1993
filing date -
Aug 6, 1992
priority date (Note) -
Expired
status (Latency Note)
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Abstract
System for packaging integrated circuits, especially sensors, in a housing, which also comprises multicontact bondings, especially hybrid ICs for three-dimensional arrangement of modules, wherein sensors (4, 5) are arranged at an angle in relation to one another on the base plate or the substrate (1). The sensors are contained in the single housing together with contact pins (pins) (2), and are connected in one plane by automatic bonding.
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