Low-density hot melt adhesive
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United States of America Patent
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-
Oct 3, 1995
Issued Date -
N/A
app pub date -
Sep 1, 1994
filing date -
Mar 30, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A low-density hot melt adhesive is disclosed. Low-density filler, preferably hollow glass microspheres, is added to a hot melt adhesive to provide a hot melt adhesive having a specific gravity preferably between 0.7 and 0.93. The low-density hot melt adhesive is more effectively separated from cellulosic materials such as cardboard and kraft paper during recycling operations which separate contaminants such as adhesives from cellulosic fibers based upon the density of the adhesive.
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