Lead-free alloy containing tin, zinc, indium and bismuth
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United States of America Patent
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Oct 3, 1995
Issued Date -
N/A
app pub date -
Jun 22, 1994
filing date -
Oct 25, 1993
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A lead-free alloy suitable for soldering comprising from about 82% to about 90% tin, from about 4.5% to about 6% zinc, from about 3.5% to about 6% indium and from about 1% to about 5% bismuth. The melting temperature of the alloy is preferably below 190.degree. C. and the alloy preferably has a pasty range of less than 10.degree. C.
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