Process for fabricating a substrate with thin film capacitor and insulating plug

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5455064
SERIAL NO

08151409

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A thin-film bypass capacitor is fabricated by forming a plurality of through holes through the thickness of a nonconductive base substrate and filling the through holes with a conductive material to form ground vias and power vias. A sequence of back side metalization layers are applied to the back side surface of the base substrate. A sequence of bottom contact layers are applied to the front side surface of the base substrate. A bottom contact power terminal is formed in the bottom contact layer and is electrically isolated from remaining portions of the bottom contact layers by insulating plugs. A bottom contact metalization layer is applied to the surface of the bottom contact layers and the insulating plugs. A dielectric layer is formed on the surface of the bottom contact metalization layer. A ground metalization via and a power metalization via are formed at the surface of the dielectric layer. A sequence of top contact layers are applied to the surface of the dielectric layer and a front side ground terminal and front side power terminal are formed. A back side ground terminal and a back side power terminal are formed at the back side of the base substrate.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
FUJITSU LIMITEDKAWASAKI18047

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chou, William T Cupertino, CA 29 1030
Peters, Michael G Santa Clara, CA 29 1348
Wang, Wen-chou V Cupertino, CA 13 715
Wheeler, Richard L San Jose, CA 22 371

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
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HEWLETT-PACKARD COMPANY (1)
* 5113314 High-speed, high-density chip mounting 25 1991
 
FUJITSU LIMITED (2)
* 5334804 Wire interconnect structures for connecting an integrated circuit to a substrate 183 1992
* 5323520 Process for fabricating a substrate with thin film capacitor 17 1993
 
RCA CORPORATION A CORP. OF DE (1)
* 4731695 Capacitor and method for making same with high yield 7 1987
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (4)
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QUALCOMM INCORPORATED (19)
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7960269 Method for forming a double embossing structure 9 2006
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* 2007/0181,970 High performance system-on-chip inductor using post passivation process 11 2007
 
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FUJITSU LIMITED (13)
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* Cited By Examiner