Semiconductor package with chip redistribution interposer
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United States of America Patent
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-
Oct 3, 1995
Grant Date -
N/A
app pub date -
Jul 18, 1994
filing date -
Jul 18, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic package with a semiconductor chip, a lead frame, a metal casing, and a redistribution interposer. The chip is mounted on the interposer and wirebonded to first ends of redistribution leads of the interposer. The redistribution leads have second ends orientated in a general flipped orientation relative to their corresponding first ends. The second ends are wirebonded to pads of the lead frame. The interposer allows smaller chips to be used in the package without changing the lead frame. The interposer also allows the chip to be flip-mounted in the package without changing the lead frame or casing, this allows redirection of the chip's thermal path.
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