Thermoelectric cooling assembly with optimized fin structure for improved thermal performance and manufacturability
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United States of America Patent
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Oct 10, 1995
Grant Date -
N/A
app pub date -
Apr 1, 1994
filing date -
Apr 1, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A configuration of solid state thermoelectric heat transfer or removal elements is provided to enhance the rate and amount of heat removal from electrical and electronic circuit devices. By rotating the thermoelectric heat transfer modules ninety degrees and by disposing them between the interdigitated fingers of a cold plate and a heat transfer plate possessing fins, improved thermal transfer is produced without the necessity of liquid coolants or moving part cooling devices. Accordingly, a method and apparatus is provided for enhancing heat transfer using thermoelectric modules. One embodiment of the present invention is particularly seen to be easy to manufacture. Additionally, this embodiment also possesses desirable heat transfer characteristics in terms of the cross sections of thermally conductive components.
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