Method of testing semiconductor chips with reusable test package
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United States of America Patent
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Oct 10, 1995
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N/A
app pub date -
Oct 28, 1993
filing date -
Oct 28, 1993
priority date (Note) -
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Abstract
A method for testing semiconductor chips using a test package having electrical contacts which have in them metallized particles which pierce the surface of the pads of a semiconductor chip, the chips being mounted on a flexible substrate which can deflect to increase the uniformity of the level to which the metallized particles pierce the surface of the pads of the semiconductor chip. If the chip tests as 'good', pressure can be applied to increase the piercing depth, thereby allowing the test package to be used as a permanent package.
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