Process and device for hermetic encapsulation of electronic components
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 24, 1995
Issued Date -
N/A
app pub date -
Sep 13, 1994
filing date -
Aug 24, 1990
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
According to an embodiment of the invention the discrete or integrated electronic components are encapsulated, each in a package, for example a plastic one; the packages are then mounted on a printed circuit board, for example an epoxy one. The components and board as a whole are covered with a relatively thick first layer consisting of an organic compound and ensuring a levelling function, followed by a second layer such as an inorganic metal compound, the function of which is to ensure the hermetic sealing of the whole.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully