Semiconductor device having a plurality of chips
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Oct 31, 1995
Issued Date -
N/A
app pub date -
May 20, 1994
filing date -
Mar 15, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device includes lead frames (21) respectively having first main surfaces and second main surfaces opposite to each other, bonding being able to be performed on the first and second main surfaces, a first semiconductor chip (22) arranged on first main surface sides of the lead frames, first tape leads (23) electrically connecting the first main surfaces of the lead frames to the first semiconductor chip, a second semiconductor chip (24) arranged on second main surface sides of the lead frames, and second tape leads (25) electrically connecting the second main surfaces of the lead frames to the second semiconductor.
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