Aluminum nitride circuit board and method of producing same
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United States of America Patent
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Nov 7, 1995
Grant Date -
N/A
app pub date -
Sep 3, 1993
filing date -
Sep 5, 1992
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An aluminum nitride circuit board includes an aluminum nitride ceramic body. An inner conductor metal which is to be used as a wiring material is formed in the aluminum nitride ceramic body. The inner conductor metal is mainly made of copper, a melting point of which is lower than a firing temperature of the aluminum nitride ceramic. A layer mainly made of a periodic table IVa group metal or compound, such as titanium, zirconium, or hafnium, is formed in an interface between the aluminum nitride ceramic body and the inner conductor metal.
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