Reflow soldering apparatus for soldering electronic parts to circuit substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 21, 1995
Grant Date -
N/A
app pub date -
Nov 23, 1993
filing date -
Nov 27, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
There is provided a reflow soldering apparatus for soldering electronic parts to a circuit substrate by blowing various inert hot gases of a desired density and temperature. A device for detecting whether or not a processing object is being conveyed into the apparatus is provided, so that the amount of inert gas to be supplied and the gas blowing speed are decreased when no processing object is present inside the apparatus. As a result, the amount of gas which flows out is made small, and a decrease in the temperature of the apparatus can be prevented. When the processing object is conveyed into the apparatus, the amount of supplied gas is increased so as to obtain a sufficient gas density. Thus, it is possible to prevent solder from being oxidized, and satisfactory solderability can be obtained.
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