Solder ball supply device
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United States of America Patent
Stats
-
Nov 21, 1995
Grant Date -
N/A
app pub date -
Oct 11, 1994
filing date -
May 31, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A solder ball supply device comprising flux supply means 200 which supplies flux at the same time to input and output terminals on substrate 1 prior to supply of solder balls, and solder ball supply means 300 which takes out a number of solder balls from discharger 350 in which solder balls are held matrixwise at the same time in the same pattern as the pattern of said input and output terminals and supplies solder balls to said input and output terminals to which flux has been supplied.
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