Copper etchant useful for making fine-line copper elements
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United States of America Patent
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Nov 21, 1995
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N/A
app pub date -
Nov 3, 1993
filing date -
Nov 3, 1993
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Abstract
Multicurved copper films having fine-line elements suitable for radome applications can be improved by cutting the elements with reproducible precision to close tolerance (typically line widths of 3-10.+-.0.25 mil) using an etchant comprising a concentrated saline solution of CuCl.sub.2.
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