Process for interconnecting conductive substrates using an interposer having conductive plastic filled vias
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United States of America Patent
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Nov 21, 1995
Issued Date -
N/A
app pub date -
Jun 15, 1994
filing date -
Aug 28, 1989
priority date (Note) -
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Abstract
A process for interconnecting conductive substrates using an interposer having conductive plastic filled vias. The process comprises the steps of forcing conductive plastic material through an end of the through holes in the interposer so that raised globs of the conductive plastic extend from an opposite end of the through holes. Then conductive pads of a first substrate are aligned and pressed against the raised globs such that the conductive plastic protrudes as bumps from the forcing ends of the through holes. Finally, conductive pads of a second substrate are aligned and pressed against the bumps.
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