Circuit elements for microwave and millimeter-wave bands and method of producing same
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United States of America Patent
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Nov 21, 1995
Grant Date -
N/A
app pub date -
Sep 14, 1994
filing date -
Sep 17, 1993
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A circuit element for microwave and millimeter-wave bands and a method of producing the same. A dielectric line is made of a pure dielectric resin. A high-frequency wave absorbing member is made of a pure dielectric resin containing at least one of first, second and third powders dispersed therein. The first powder having a high specific inductive capacity, the second powder having a high magnetic permeability, and the third powder having a high specific resistance. A compression molding technique is used to fusion bond the high-frequency wave absorbing member to the dielectric line.
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