Hybrid integrated circuit device
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United States of America Patent
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-
Nov 21, 1995
Grant Date -
N/A
app pub date -
Aug 30, 1993
filing date -
Aug 28, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A resistive body of a hybrid integrated circuit has a resistance pattern on a resin film. Bonding pads permit connection of current through the resistance pattern. The resistance pattern may form part of a detecting bridge for overcurrent detection. One embodiment of the invention uses a rectangular resistance pattern with an opening in the center to force current to flow on a perimeter path for minimizing maximum temperature. Another embodiment uses a serpentine resistance pattern. A face-down resistance patter reduces interference. A direct-connection bonding pad reduces the voltage generated in a parasitic capacitance to improve the resistance of the resin film to voltage breakdown.
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