Integrated decoupling capacitive core for a printed circuit board and method of making same

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United States of America Patent

PATENT NO 5469324
SERIAL NO

08319651

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A printed circuit board includes a planar first outer layer, a planar second outer layer, and a planar capacitive power distribution core disposed between the first and second outer layers. The capacitive core is formed from first and second electrically conductive layers with a dielectric layer disposed therebetween. The dielectric layer is made from a high dielectric constant material such as a ceramic in the form of a perforated sheet. The perforations permit the electrically conductive layers to be bound to the dielectric layer without significantly increasing the separation between the conductive layers. Each perforation allows a column of adhesive to collect therein to bond the power distribution core together. The resulting capacitance is typically sufficient to eliminate the need for decoupling capacitors.

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Patent Owner(s)

  • STORAGE TECHNOLOGY CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Henderson, Watson R Broomfield, CO 4 222
Paurus, Floyd G Boulder, CO 7 648
Szerlip, Stanley R Longmont, CO 9 751

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