Self-aligned via structure
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United States of America Patent
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Nov 28, 1995
Grant Date -
N/A
app pub date -
Feb 24, 1994
filing date -
Feb 24, 1994
priority date (Note) -
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Abstract
A self-aligned via between interconnect layers in an integrated circuit allows a less precise masking alignment to be used to fabricate an integrated circuit with increased packing density and improved yield. In one embodiment, self-aligned vias are used to connect first and second interconnect layers in an SRAM memory cell.
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