Apparatus and method for spin coating wafers and the like

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United States of America Patent

PATENT NO 5472502
SERIAL NO

08114820

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Abstract

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An apparatus and method are provided for controlling the rate of drying of a high-viscosity chemical applied to a substantially flat surface of a spinning article. The rate of drying of the chemical is controlled by controlling the saturation level of a solvent in the local atmosphere in which the article is spinning, i.e., in the air space adjacent to the surface of the article. By spinning the article in a solvent-laden vapor, the evaporation of solvent from the chemical is slowed and therefore the rate at which the chemical dries and thickens is also slowed. Spreading of the chemical may also be facilitated and premature drying of the chemical may be avoided by applying to the surface of the article a thin layer of the solvent prior to application of the chemical.

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Patent Owner(s)

Patent OwnerAddress
SEMICONDUCTOR SYSTEMS INC47003 MISSION FALLS COURT FREMONT CA 94539

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Batchelder, William T San Mateo, CA 4 226

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