Electronic device package having electronic device boonded, at a localized region thereof, to circuit board
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United States of America Patent
Stats
-
Dec 5, 1995
Issued Date -
N/A
app pub date -
Jun 16, 1994
filing date -
Dec 16, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic device, such as an integrated circuit chip or a multichip module, is held in place overlying a circuit board, with which it is thermal expansion mismatched, by three or more localized rigid support elements. The bottom surface of the chip is bonded to the top surface of preferably only one of these support elements and can laterally slide along the top surfaces of the others in response to heating and cooling during electrical operations of the electronic device. In addition, the electronic device is encapsulated in a soft gel that is held in place by a rigid plastic half-shell cover that is epoxy-bonded in place along its perimeter (edge).
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