Laser system and method for selectively severing links
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United States of America Patent
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Dec 5, 1995
Issued Date -
N/A
app pub date -
Nov 22, 1994
filing date -
Sep 10, 1992
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A laser system and processing method exploits the absorption contrast between the materials from which a link (12) and an underlying substrate (22) are made to effectively remove the link from the substrate. Laser output in a wavelength range of 1.2 to 3 .mu.m (30) optimizes the absorption contrast between many materials (e.g., metals, polysilicon, polycides, or disilicides) and integrated circuit substrates (e.g., silicon, gallium arsenide, or other semiconductors) and permits the use of laser output in a wider range of energy or power levels, pulse widths, and spot sizes without risking damage to the substrates or adjacent circuit structures. Existing link processing laser systems can be readily modified to operate in the 1.2 to 3 .mu.m range.
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