Encapsulated accelerometer with faraday shielding
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United States of America Patent
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-
Dec 12, 1995
Grant Date -
N/A
app pub date -
Jul 30, 1993
filing date -
Jul 30, 1993
priority date (Note) -
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Abstract
An accelerometer with internal electronics is mounted within a Faraday shield and encapsulated within a non-electrically conductive material applied by hot injection molding at a high pressure to form a hermetically sealed case with integral strain-relief, cable bend protection, ground loop isolation and protection against EMI/RFI interference through both conduction and radiation. The accelerometer is shaped as a torus with the center hole providing center hole bolt mounting.
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