Conductor-filled thermosetting resin
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United States of America Patent
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Dec 12, 1995
Issued Date -
N/A
app pub date -
Dec 7, 1993
filing date -
Apr 3, 1992
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Conductor-filled thermosetting resins having a free radical based cure chemistry are prepared for use as solder paste replacements for electrical conducting attachments of surface mount electronics components to printed circuit boards and as a die attach adhesive. The thermosetting resins exhibit rheological properties that allow them to be substituted for state-of-the-art solder paste and die attach adhesives. The conductor filled resins can be thermally cured in in-line processing operations to provide a low stress, substrate adherent, electrically conductive resin matrix.
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