Importance

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Abstract

A semiconductor chip for mounting on a package substrate by a flip-chip process includes a plurality of electrode pads of a first group provided on a major surface of the semiconductor chip for external electrical connection such that the electrode pads of the first group cover a major surface of the semiconductor chip in rows and columns; and a plurality of electrode pads of a second group each having a size substantially larger than the electrode pads of the first group and provided on the major surface of the semiconductor chip in electrical connection with an active part of the semiconductor chip that is used for a burn-in process. Each of the electrode pads of the first group is covered by a solder bump that projects from the major surface of the semiconductor chip a first distance. Each of the electrode pads of the second group is formed of a conductor material having a melting point higher than the solder bump and projecting from the major surface of the semiconductor chip a second distance that is substantially smaller than the first distance.

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First Claim