Method of assembling ultra high density integrated circuit packages

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United States of America Patent

PATENT NO 5475920
SERIAL NO

08206311

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Abstract

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A method and apparatus for providing a multiple-element ultra high density level-two integrated circuit modular package utilizing a temporary manufacturing fixture to achieve a stack of individual thin ultra high density integrated circuit packages.

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Patent Owner(s)

Patent OwnerAddress
STAKTEK GROUP L P8900 SHOAL CREEK BLVD SUITE 125 AUSTIN TX 78757

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Burns, Carmen D 10210 Holme-Lacey La., Austin, Travis County, TX 78750 72 4439
Cady, James W 6803 Bayridge Ter., Austin, Travis County, TX 78759 60 1952
Roane, Jerry M 101 Laurelwood Dr. South, Austin, Travis County, TX 78733 15 455

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