Photosensitive compositions
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United States of America Patent
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Dec 19, 1995
Issued Date -
N/A
app pub date -
Dec 14, 1993
filing date -
Dec 21, 1992
priority date (Note) -
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status (Latency Note)
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Abstract
The invention relates to photosensitive compositions comprising A) from 40 to 80% by weight of at least one liquid epoxy resin having an epoxy functionality of equal to or greater than 2, B) from 0.1 to 10% by weight of at least one cationic photoinitiator for component A), C) from 5 to 40% by weight of at least one liquid cycloaliphatic or aromatic diacrylate, D) from 0 to 15% by weight of at least one liquid poly(meth-)acrylate having a (meth-)acrylate functionality of greater than 2, the proportion of component D) constituting a maximum of 50% by weight of the total (meth-)acrylate content, E) from 0.1 to 10% by weight of at least one radical photoinitiator for component C) and, where appropriate, D) and F) from 5 to 40% by weight of at least one OH-terminated polyether, polyester or polyurethane, which are especially suitable, for example, for the manufacture of photopolymerized layers, especially of three-dimensional objects.
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