Module test card
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United States of America Patent
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-
Dec 19, 1995
Issued Date -
N/A
app pub date -
Aug 6, 1993
filing date -
Aug 12, 1992
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Manufacturing of semiconductor devices is facilitated when the device chip carriers of the devices are tested, prior to population of chips thereon, by a module test card. The module test card is formed by a test substrate and a plurality of test chips mounted on the test substrate. Connections are provided on the test substrate for connecting to a tester. Through the module test card, the device chip carriers are tested under simulation of their operating conditions.
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