Method of forming interface between die and chip carrier
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United States of America Patent
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Dec 26, 1995
Grant Date -
N/A
app pub date -
Sep 20, 1993
filing date -
Sep 20, 1993
priority date (Note) -
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Abstract
A method for creating an interface between a chip and chip carrier includes spacing the chip a given distance above the chip carrier, and then introducing a liquid in the gap between the chip and carrier. Preferably, the liquid is an elastomer which is hardened into a resilient layer after its introduction into the gap. In another preferred embodiment, the terminals on a chip carrier are planarized or otherwise vertically positioned by deforming the terminals into set vertical locations with a plate, and then hardening a liquid between the chip carrier and chip.
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