Electronic device interconnection techniques
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United States of America Patent
Stats
-
Dec 26, 1995
Grant Date -
N/A
app pub date -
Oct 24, 1994
filing date -
Oct 24, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic device (11) has on one surface a first ball grid array (12) having a first area. The first ball grid array is bonded to a first intermediate interconnection member (13) having on an opposite surface a second ball grid array having the same number of solder balls (23) as the first array, but of a significantly larger area than that of the first array. Each of the solder balls (23) of the second ball grid array is connected by a connection comprising a conductive via ( 18, 19) extending through the first interconnection member (13) to one of the solder balls of the first ball grid array.
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