Method for controlling a collimated sputtering source
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United States of America Patent
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-
Dec 26, 1995
Grant Date -
N/A
app pub date -
Sep 17, 1993
filing date -
Sep 17, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for automatically controlling a collimated sputtering source that is controllable by a computer to compensate for the build-up of sputtered material on the collimator. The method involves providing software for the computer including a formula to calculate a multiplier as a function of the age of the collimator, sequentially depositing film on a series of substrates using the sputtering source, monitoring the age of the collimator, and using the software to periodically adjust the value of a controllable sputtering parameter as a function of the multiplier. The sputtering parameter is automatically adjusted by the software such that a property of the film deposited by the source on the series of substrates does not substantially vary among the substrates as sputtered material builds up on the collimator.
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