Electrically conductive projections and semiconductor processing method of forming same
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United States of America Patent
Stats
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Dec 26, 1995
Grant Date -
N/A
app pub date -
Mar 7, 1994
filing date -
Mar 7, 1994
priority date (Note) -
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Abstract
An electrically conductive apparatus includes, a) an electrically non-conducting substrate, the substrate having a base surface and an adjacent elevated surface, the elevated surface being spaced from the base surface by a first distance thereby defining a step having a step wall; b) a capping layer of first electrically conductive material coating the elevated surface only portions of the step wall, the capping layer having outer top and outer side portions; and c) a conductive trace of second electrically conductive material which is different from the first electrically conductive material; the conductive trace overlying the substrate, portions of the step wall not covered by the capping layer, and the outer side portions of the capping layer. Methods are disclosed for producing such a construction, for forming an electrically conductive projection outwardly extending from a substrate, and for providing an electrical interconnection between adjacent different elevation areas on a substrate.
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Patent Owner(s)
| Patent Owner | Address | |
|---|---|---|
| MICRON TECHNOLOGY INC | 8000 SOUTH FEDERAL WAY BOISE ID 83716-9632 |
International Classification(s)
Inventor(s)
| Inventor Name | Address | # of filed Patents | Total Citations |
|---|---|---|---|
| Akram, Salman | Boise, ID | 801 | 30978 |
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| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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