Multi-layer wiring board
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United States of America Patent
Stats
-
Dec 26, 1995
Grant Date -
N/A
app pub date -
Dec 27, 1994
filing date -
Dec 27, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a multi-layer wiring board having a strip line structure in which a grounding conductor wiring and a signal circuit wiring are disposed by interposing therebetween an insulation layer, the grounding conductor wiring is in the form of a grid and an open area ratio Rx [%]of the grid and a line width ratio Ry=Wg/Ws have a relationship expressed by Ry, .ltoreq.25.98.times.Rx.sup.-0.3871 -4.370 where Wg is the line width of the grounding conductor wiring, Sg is the width of an opening of the grid, Ws is the line width of the signal circuit wiring, and Rx={Sg/(Wg+Sg)}.sup.2 .times.100.
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Family
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Cited Art Landscape
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