Bus communication system for stacked high density integrated circuit packages with trifurcated distal lead ends
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United States of America Patent
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Dec 26, 1995
Issued Date -
N/A
app pub date -
May 12, 1995
filing date -
Mar 7, 1994
priority date (Note) -
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Abstract
The present invention is a rail-less bus system for a high density integrated circuit package, or module, made up of a plurality of vertically stacked high density integrated circuit devices. Each device has leads extending therefrom with bifurcated or trifurcated distal lead ends which electrically connect with lead ends of adjacent integrated circuit devices. The bus system provides a path for communication from the module to external electronic devices and internal communication between the individual integrated circuit devices in the module.
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