Real time control of plasma etch utilizing multivariate statistical analysis
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United States of America Patent
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Dec 26, 1995
Grant Date -
N/A
app pub date -
Sep 20, 1993
filing date -
Sep 20, 1993
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Hotelling's T.sup.2 statistical analysis and control is used to provide multivariate analysis of components of an RF spectra for real time, in-situ control of an ongoing semiconductor process. An algorithm calculates the T.sup.2 value which is then used to generate a feedback signal, if the T.sup.2 value is out of range, to indicate an out-of-tolerance condition.
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