Electrochemical etch system and method
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United States of America Patent
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Jan 2, 1996
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N/A
app pub date -
Feb 6, 1995
filing date -
Feb 6, 1995
priority date (Note) -
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Abstract
A method and apparatus for forming lead frames and eliminating irregularities in the edge (22) of openings etched in the sheet metal from which the lead frame is formed. In a first process, a photo resist coated metal sheet (36) is first etched by a photo chemical process to define the lead frame, and then the lead frame metal sheet (36) is etched in an electrochemical process to remove edge irregularities. In a second process, the entire lead frame is formed in an electrochemical process.
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