Semiconductor device manufacturing method
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United States of America Patent
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Jan 2, 1996
Grant Date -
N/A
app pub date -
Jan 11, 1994
filing date -
Jan 15, 1993
priority date (Note) -
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status (Latency Note)
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Abstract
With a semiconductor device manufacturing method, a lower-layer interconnection is formed on a circuit board on which a plurality of semiconductor chips are mounted. Using a screen plate with openings corresponding to desired positions on the lower-layer interconnection, screen printing of a metal paste is effected, and the printed metal paste is dried and calcined by heat treatment to form a metal pillar on the lower-layer interconnection. An insulating film covering the lower-layer interconnection and the metal pillar is formed so that the tip of the metal pillar may be exposed. An upper-layer interconnection is formed on the insulating film so that this layer may contact with the exposed tip of the metal pillar.
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