Three-dimensional multichip package
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United States of America Patent
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-
Jan 2, 1996
Issued Date -
N/A
app pub date -
Dec 29, 1994
filing date -
Mar 21, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multichip array package for IC devices with a master semiconductor device supporting and electrically interconnected with a stacked array of subordinate devices. The interconnection structure has a peripheral row of contact pads on the master device. The subordinate devices each have a peripheral row of contact pads that corresponds to the peripheral row on the master device. Openings are provided through the contact pads on the subordinate devices that are in registry. The holes are filled with metal which interconnects the subordinate devices with the master device.
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