Film-type heat sink-mounted power resistor combination having only a thin encapsulant, and having an enlarged internal heat sink
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United States of America Patent
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-
Jan 2, 1996
Grant Date -
N/A
app pub date -
Nov 12, 1993
filing date -
Nov 12, 1993
priority date (Note) -
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Abstract
A low-cost heat sink-mounted power film resistor having a high power rating for its footprint size, and not incorporating any housing. The resistor is bolted or otherwise secured tightly to an external heat sink in high heat-conduction relationship, the external heat sink being contacted flatwise by a rectangular internal heat sink. The footprint size and shape of the internal heat sink correspond substantially to those of commercially-marketed power film resistors having molded synthetic resin housings. The internal heat sink is bonded in high heat-conductivity relationship to a ceramic chip having a resistive film on the side thereof remote from the heat sink. Over such resistive film is a thin environmental coating. The leads are provided and connected to spaced portions of the film, on metalization pads.
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