High density semiconductor package
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United States of America Patent
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-
Jan 9, 1996
Grant Date -
N/A
app pub date -
Oct 8, 1993
filing date -
Oct 8, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention discloses a high density semiconductor package. In one embodiment, two semiconductor chips are each affixed on a corresponding one of two lead frames. The semiconductor chips and the lead frames are encapsulated, wherein only a portion of the leads of the lead frames protrudes and extends from the package.
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