Apparatus for controlling electromagnetic interference from multi-layered circuit boards

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United States of America Patent

PATENT NO 5483413
SERIAL NO

08329138

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A printed circuit board is shown to include at least one layer formed from electrically insulating material and a power plane formed on the layer. The outer perimeter of the power plane is spaced away from the outer edge of the layer thereby defining an outer area. A conductive structure is formed in the outer area, spaced from and surrounding the power plane and adapted to be connected to ground. Electromagnetic radiation emanating from the power plane is caused to terminate on the conductive structure. A multi-layered printed circuit board can also include a first layer of electrically insulating material, a ground plane formed on the first layer, a second layer of electrically insulating material and a power plane formed on the second layer. The outer perimeter of the power plane is spaced away from the outer edge of the second layer. A conductive structure is formed on the second layer in the outer layer, spaced from and surrounding the power plane, wherein the conductive structure is electrically connected to the ground plane. In an alternate embodiment wherein the power plane and ground plane are formed on opposite sides of the same layer, the thickness of the layer and the distance the power plane is spaced away from the outer edge of the layer are sufficient so that electromagnetic radiation emanating from the power plane is caused to terminate on the ground plane.

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Patent Owner(s)

Patent OwnerAddress
HEWLETT-PACKARD DEVELOPMENT COMPANY L P10300 ENERGY DRIVE SPRING TX 77389

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Babb, Samuel M Fort Collins, CO 36 718

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