Method of making homogeneous thermoplastic semi-conductor chip carrier package
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United States of America Patent
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Jan 16, 1996
Issued Date -
N/A
app pub date -
Nov 28, 1994
filing date -
May 26, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A homogeneous thermoplastic semi-conductor chip carrier cavity package (HC package) which utilizes the same thermoplastic for various integral attachments to the HC package, such as, a molded lid and a circuit substrate. A chemical bonding or fusing of the integral attachments to the HC package provides increased protection from having moisture enter into the cavity of the HC package. The HC package eliminates problems which are associated with having different coefficients of thermal expansion for the HC package and its various integral attachments.
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