Substrate treating apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5485644
SERIAL NO

08210177

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A substrate treatment apparatus includes a loader 1 for soaking a plurality of wafers W in deionized water, a back surface cleaning portion 2, a front surface cleaning portion 3, a rinsing and drying unit 4 and a plurality of transporting units 6. The back surface cleaning unit 2 cleans the back surface of the wafer W with a brush from the lower side by supplying deionized water to the wafer W that is removed from the loader 1. The front surface cleaning unit 3 cleans the upper surface of the wafer W with a brush by supplying deionized water to the wafer W cleaned by the back surface cleaning unit 2. The rinsing and drying unit 4 rinses the cleaned wafer W and then dries it. There is a transporting unit 6 disposed between the loader 1 and the back surface cleaning unit 2, another unit 6 is disposed between unit 2 and the upper surface cleaning unit 3, and another unit 6 is disposed between unit 3 and the rinsing and drying unit 4 while each of these three transporting units 6 transports the wafer W, deionized water is supplied to the wafer W to prevent being dried during the cleaning treatment.

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Patent Owner(s)

Patent OwnerAddress
DAINIPPON SCREEN MFG CO LTDKYOTO JAPAN KYOTO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kurata, Yasuhiro Shiga, JP 5 557
Sawamura, Masashi Shiga, JP 6 156
Shinbara, Kaoru Shiga, JP 6 453

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