Device for conditioning polishing pads
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United States of America Patent
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Jan 23, 1996
Grant Date -
N/A
app pub date -
Jan 4, 1994
filing date -
Jan 4, 1994
priority date (Note) -
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status (Latency Note)
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Abstract
A device for conditioning the surface of a polishing pad covering a platen mounted on a polishing machine for rotation about a vertical axis, comprising a rigid carrier element carrying cutting means on its bottom surface and which is adapted for vertical movement into and out of engagement with the surface of a polishing pad and which is adapted for oscillating horizontal movement over the surface of the polishing pad. The cutting means are dispersed in a circular or ring configuration.
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