Method for making printed circuit boards with selectivity filled plated through holes
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 30, 1996
Grant Date -
N/A
app pub date -
Nov 21, 1994
filing date -
Nov 21, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Disclosed is a printed circuit board and a method of preparing the printed circuit board. The printed circuit board has two types of plated through holes. The first type of plated through holes extend to and through an exterior surface of the printed circuit board for receipt of a pin-in-through-hole module or component pin. The second type of plated through holes are for surface mount technology and terminate below the exterior surface of the printed circuit board. These plated through holes contain a fill composition.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully