Importance

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Abstract

An apparatus and method for conditioning the leads of a semiconductor device having parallel leads formed to a predetermined configuration. The apparatus includes a device for engaging and massaging the leads to reintroduce a predetermined spacing between the leads, bringing the leads into parallelism. The apparatus also includes a device for forming the leads to a partially unbent condition having at least one clamping arm pivotal between a first position spaced from the leads and a second position compressing a portion of the leads between the clamping arm and the support. The apparatus further includes a device for reforming the leads to a predetermined configuration. The lead conditioning method includes the steps of bringing the leads into parallelism, positioning the semiconductor device on a support, forming the leads to a partially unbent condition by pivoting at least one arm toward the leads and compressing a portion of the leads between the arm and the support, and shaping the leads to a partially unbent condition.

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First Claim