Method of fabricating a thin film transistor using a nickel silicide layer to promote crystallization of the amorphous silicon layer

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United States of America Patent

PATENT NO 5488000
SERIAL NO

08260413

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Abstract

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Method of fabricating TFTs starts with forming a nickel film selectively on a bottom layer which is formed on a substrate. An amorphous silicon film is formed on the nickel film and heated to crystallize it. The crystallized film is irradiated with infrared light to anneal it. Thus, a crystalline silicon film having excellent crystailinity is obtained. TFTs are built, using this crystalline silicon film.

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Patent Owner(s)

Patent OwnerAddress
SEMICONDUCTOR ENERGY LABORATORY CO LTDKANAGAWA-KEN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Teramoto, Satoshi Kanagawa, JP 312 11749
Zhang, Hongyong Kanagawa, JP 462 30622

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