MCM manufactured by using thin film multilevel interconnection technique
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United States of America Patent
Stats
-
Jan 30, 1996
Grant Date -
N/A
app pub date -
Aug 17, 1994
filing date -
Aug 18, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The multichip module includes a ceramic multilayer substrate, a thick film wiring, a thick film insulator, a thin film multilayer wiring portion and semiconductor chips. The thick film wiring and the thick film insulator are laminated on the ceramic multilayer substrate. The thin film multilayer wiring portion is formed on the thick film insulator. In this thin film multilayer wiring portion, thin film wirings and thin film insulators are alternately laminated. The semiconductor chips are mounted on the thin film insulator of the thin film multilayer wiring portion, and the chips are electrically connected to a plurality of bonding pads made of the thin film wirings of the thin film multilayer wiring portion. A thick film wiring is situated underneath each bonding pad, and the thick film wiring is electrically connected to the thin film wiring in order to serve as a part of the wiring.
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